We are living in a time of rapid transformation, where technological advancement and the business environment shift constantly. Just a few years ago, breakthrough technologies that once disrupted the market have either faded away or been commercialized, triggering new waves of innovation. This is especially true in the tech sector, where changes happen at a dizzying pace. Today’s leading technologies—secondary batteries, semiconductor processing, and artificial intelligence—may be replaced by new breakthroughs as early as next year.
BLT Patent & Law Firm seeks to monitor and interpret these changes through this column series, offering TechInsight by analyzing technology trends and corporate investment cases that reflect the evolving business environment.
[Chiplets: The Cutting-Edge Technology Driving a New Era of System Semiconductors]
System semiconductors are at the core of AI advancement. Often referred to as the “brain” of computers, they serve as the central processing unit (CPU) and are embedded in critical components of emerging industries—autonomous vehicles, the Internet of Things (IoT), and artificial intelligence. Simply put, system semiconductors power the future.
[Fig] AI Semiconductor Market Size and Key Features
In recent years, chiplets have emerged as a transformative approach within the system semiconductor field. Unlike traditional monolithic chips, chiplets break down large chips into smaller modular components that are then tightly integrated. Traditional chips faced scalability issues as performance improvements required larger physical sizes. Chiplets, by contrast, are compact, interconnected units suitable for high-performance computing systems. However, connecting these smaller chips via interconnect lines poses unique technical challenges.
[Fig] Overview of Chiplet Technology
PrimeMass Co., Ltd. (CEO Il Park), a fabless semiconductor startup, has developed the Hub Chiplet SoC (product name: Falcon) and secured 9.3 billion KRW in Pre-Series A funding just eight months after its founding. PrimeMass’s chiplet-based SoC is designed for AI semiconductors and is the industry’s first chiplet-based AI SoC, reducing manufacturing costs by up to 90% compared to conventional AI chips. The company aims to supply its chiplets to hyperscalers like Naver, Google, and Microsoft, as well as memory giants such as Samsung Electronics and SK hynix.
[Fig] PrimeMass’s Hub Chiplet SoC Technology
As interest in system semiconductors grows, chiplet R&D is also accelerating.
AMD (CEO: Lisa Su) introduced Infinity Fabric technology in 2017 to address data transfer bottlenecks in chiplets and has recently developed models with enhanced integration and reduced defect rates.
Intel (CEO: Pat Gelsinger) has adopted multi-die packaging technologies to increase chip yield and performance through advanced packaging methods.
Tokyo Electron (CEO: Toshiki Kawai) has developed 3D chiplet designs using primary and secondary stress layers that improve scalability and structural integrity.
[Fig] Intel’s “Meteor Lake” Powered by Chiplet Integration
Samsung Electronics (CEOs: Kyehyun Kyung, Jonghee Han) has committed to massive investments in the system semiconductor space, focusing on both design capabilities and foundry competitiveness.
SK hynix (Co-CEOs: Noh-Jung Kwak, Jung-Ho Park) also made a bold move by acquiring Key Foundry, a system semiconductor foundry, to expand its development capabilities.
As the semiconductor industry continues to evolve, chiplets are emerging as a super-gap technology, offering unmatched advantages. In this dynamic environment, preemptive adaptation and strategic investment in chiplet innovation will be essential for companies aiming to lead.
#Chiplet #SystemSemiconductor #AI #SemiconductorProcess #SoC #PrimeMass #AdvancedPackaging #TechInsight
We are living in a time of rapid transformation, where technological advancement and the business environment shift constantly. Just a few years ago, breakthrough technologies that once disrupted the market have either faded away or been commercialized, triggering new waves of innovation. This is especially true in the tech sector, where changes happen at a dizzying pace. Today’s leading technologies—secondary batteries, semiconductor processing, and artificial intelligence—may be replaced by new breakthroughs as early as next year.
BLT Patent & Law Firm seeks to monitor and interpret these changes through this column series, offering TechInsight by analyzing technology trends and corporate investment cases that reflect the evolving business environment.
[Chiplets: The Cutting-Edge Technology Driving a New Era of System Semiconductors]
System semiconductors are at the core of AI advancement. Often referred to as the “brain” of computers, they serve as the central processing unit (CPU) and are embedded in critical components of emerging industries—autonomous vehicles, the Internet of Things (IoT), and artificial intelligence. Simply put, system semiconductors power the future.
[Fig] AI Semiconductor Market Size and Key Features
In recent years, chiplets have emerged as a transformative approach within the system semiconductor field. Unlike traditional monolithic chips, chiplets break down large chips into smaller modular components that are then tightly integrated. Traditional chips faced scalability issues as performance improvements required larger physical sizes. Chiplets, by contrast, are compact, interconnected units suitable for high-performance computing systems. However, connecting these smaller chips via interconnect lines poses unique technical challenges.
[Fig] Overview of Chiplet Technology
PrimeMass Co., Ltd. (CEO Il Park), a fabless semiconductor startup, has developed the Hub Chiplet SoC (product name: Falcon) and secured 9.3 billion KRW in Pre-Series A funding just eight months after its founding. PrimeMass’s chiplet-based SoC is designed for AI semiconductors and is the industry’s first chiplet-based AI SoC, reducing manufacturing costs by up to 90% compared to conventional AI chips. The company aims to supply its chiplets to hyperscalers like Naver, Google, and Microsoft, as well as memory giants such as Samsung Electronics and SK hynix.
[Fig] PrimeMass’s Hub Chiplet SoC Technology
As interest in system semiconductors grows, chiplet R&D is also accelerating.
AMD (CEO: Lisa Su) introduced Infinity Fabric technology in 2017 to address data transfer bottlenecks in chiplets and has recently developed models with enhanced integration and reduced defect rates.
Intel (CEO: Pat Gelsinger) has adopted multi-die packaging technologies to increase chip yield and performance through advanced packaging methods.
Tokyo Electron (CEO: Toshiki Kawai) has developed 3D chiplet designs using primary and secondary stress layers that improve scalability and structural integrity.
[Fig] Intel’s “Meteor Lake” Powered by Chiplet Integration
Samsung Electronics (CEOs: Kyehyun Kyung, Jonghee Han) has committed to massive investments in the system semiconductor space, focusing on both design capabilities and foundry competitiveness.
SK hynix (Co-CEOs: Noh-Jung Kwak, Jung-Ho Park) also made a bold move by acquiring Key Foundry, a system semiconductor foundry, to expand its development capabilities.
As the semiconductor industry continues to evolve, chiplets are emerging as a super-gap technology, offering unmatched advantages. In this dynamic environment, preemptive adaptation and strategic investment in chiplet innovation will be essential for companies aiming to lead.
#Chiplet #SystemSemiconductor #AI #SemiconductorProcess #SoC #PrimeMass #AdvancedPackaging #TechInsight