[BLT Insight]Chiplet technology in Korea

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System semiconductors are pivotal to the advancement of AI. These semiconductors are the products that serve as the 'brains,' acting as the central processing unit (CPU) in computers. They are essential components in future industries such as autonomous vehicles, the Internet of Things (IoT) connecting all devices, and artificial intelligence (AI).


[Overview of the AI Semiconductor Market]


Recently, chiplets have become a major focus in the system semiconductor industry. Chiplets are semiconductors that replace the traditional 'big chip' with smaller chips integrated together. The problem with traditional large single chips was that as performance improved, their size also increased. Chiplets, on the other hand, integrate smaller chips, making them suitable for system semiconductors requiring computation. However, chiplets faced technical limitations as each 'small chip' had to be connected via communication lines.

[Explanation of Chiplet Technology]


Primemas Co., Ltd. (CEO Park Il), a fabless semiconductor company, successfully developed the 'Hub Chiplet SoC (System-on-Chip, marketed as Falcon)' and raised ₩93 billion (Pre-A) in funding within eight months of its establishment. Prime Mass's chiplets can be utilized in AI semiconductors, offering industry-first chiplet-based SoC development, which can reduce the costs of existing AI semiconductor chip manufacturing by up to 90%. In the future, Primemas' semiconductor chiplets are expected to be supplied to hyperscalers (large-scale data center operators) such as Naver, Google, Microsoft, as well as large-capacity memory semiconductors like Samsung Electronics and SK Hynix.


[Primemas' Hub Chiplet SoC Technology]


Chiplet technology is actively being developed alongside the growing interest in system semiconductors. AMD (CEO Lisa Su) developed chiplets with improved communication bottlenecks by applying Infinity Fabric technology in 2017 and has recently succeeded in developing chiplets with improved integration and reduced defect rates. Intel (CEO Pat Gelsinger) also developed chiplets with improved yields by applying enhanced packaging methods for multi-die electronic packaging. Tokyo Electron (CEO Toshiki Kawai) developed 3D chiplets with ease of scaling by forming the first and second stress films. Thus, chiplet technology is advancing significantly in line with the development of AI.


[Intel's 'Meteor Lake' with Chiplet Technology]


Samsung Electronics (CEO Kinam Kim, Jong-hee Han) has declared significant investments in system semiconductors and is focusing on enhancing competitiveness in both design and foundry sectors. SK Hynix (CEO Seok-No Jung, Jeong-Ho Park) also staked its corporate survival by acquiring the system semiconductor foundry company, KiP Foundry, last year and is putting efforts into system semiconductor development capabilities. In the changing environment of the semiconductor industry, chiplet technology can become a powerful differentiator. Therefore, companies recognize the importance of adapting to and preempting these changes.


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Head Office 1F, 25, Beobwon-ro 3-gil, Seocho-gu, Seoul, 06595 Republic of Korea

Tel : +82-2-514-0104     Fax : +82-70-4855-0102     E : info@blt.kr

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